F4BM265 High-Frequency PCB with 6.2mm Thick Core for RF/Microwave Applications
1.Product Introduction: Advanced PTFE Composite Material
The F4BM265 laminate represents a significant advancement in high-frequency circuit materials, combining fiberglass cloth, PTFE resin, and PTFE film through a scientifically formulated pressing process. This improved version of F4B offers superior electrical performance with a wider range of dielectric constants, lower loss, higher insulation resistance, and enhanced stability. The material comes in two variants: F4BM with standard ED copper for general applications, and F4BME with reverse-treated foil (RTF) copper for superior PIM performance and conductor loss reduction.
2.Key Material Properties (F4BM265)
Precision Dielectric Constant: 2.65±0.05 @10GHz
Low Signal Loss: 0.0013 dissipation factor @10GHz
Temperature Stability: -100 ppm/°C ΔDk (-55°C to 150°C)
CTE Characteristics: 14/17/142 ppm/°C (X/Y/Z axes)
Thermal Conductivity: 0.36 W/mK
Moisture Resistance: 0.08% absorption
3.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | F4BM265 PTFE Composite |
| Layer Count | 3-Layer |
| Board Dimensions | 168mm × 168mm (±0.15mm) |
| Minimum Trace/Space | 6/8 mils |
| Minimum Hole Size | 0.4mm |
| Via Type | Through-Hole Only |
| Finished Thickness | 6.2mm |
| Copper Weight | 1oz (35μm) all layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Bare Copper |
| Silkscreen (Top/Bottom) | None / None |
| Solder Mask (Top/Bottom) | None / None |
| Electrical Testing | 100% tested prior to shipment |
4.PCB Stackup:
F4BM265 Core - 3.0 mm (118mil)
Copper layer 2 - 35 μm
---------------Bonding ply --------------
F4BM265 Core - 3.0 mm (118mil)
Copper layer 3 - 35 μm
5.Board Statistics
Components: 49
Total Pads: 177
Thru Hole Pads: 79
Top SMT Pads: 98
Bottom SMT Pads: 0
Vias: 164
Nets: 6
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Technical Advantages
Optimized PTFE Formulation: Improved over standard F4B materials
Dimensional Stability: Tight CTE control for reliable plated through-holes
Design Flexibility: Available with ED or RTF copper options
High-Frequency Performance: Stable electrical properties up to 20GHz
8.Target Applications
Microwave, RF, and radar systems
Phase shifters, passive components
Power dividers, couplers, combiners
Feed networks, phased array antennas
Satellite communications
Base station antennas.